SCHOTT TO PLUS Wins R&D 100 Awards

SCHOTT has won the prestigious R&D 100 Award for its emerging product. SCHOTT TO PLUS® transistor outline (TO) headers won in the IT/Electrical category.

The product was introduced to the market within the last year and underscores the impact of SCHOTT’s R&D team. The company invests 4% of its revenue into R&D activities to promote sustainable growth, and those efforts have spurred 3,500 worldwide patents. SCHOTT will formally accept the award at a banquet on Nov. 16, 2023, in Coronado, California.

SCHOTT TO PLUS is a transistor outline packaging solution that enables unprecedented transmission speeds for fiber-optic data transmission.

SCHOTT TO PLUS is a header packaging solution that enables unprecedented transmission speeds for fiber-optic data transmission. Hermetically sealed with glass-to-metal sealing technology, 50G TO PLUS headers deliver an unmatched transmission speed of 50 gigabytes per second, twice as much data over a single fiber than existing technology, and are more economical for semiconductor and data communication manufacturers.

“This innovation is a testament to the hard work of our nearly 700 researchers around the world,” said Dr. Frank Heinricht, CEO of SCHOTT. “The activity allows SCHOTT to deliver a balanced product portfolio and maintain our position as one of the most cutting-edge companies in the world. TO PLUS is a shining example of our team’s work and the ability for glass to play a leading role in the next generation of technology.”